SMD & gob
A photo shown clearly the difference between SMD LED module and GOB LED Module.
GOB is the abbreviation of Glue on board.
It is a kind of packaging technology. It is a technology to solve the problem of LED lamp protection.
It uses an advanced new transparent material to package the substrate and its LED package unit to form effective protection.
This material not only has ultra-high transparency but also has superior thermal conductivity.
The GOB can be adapted to any harsh environment with a small gap to achieve true moisture, water, dust, impact and UV resistance.
Compared with the traditional SMD, it is characterized by high protection, moisture-proof, waterproof, anti-collision, and anti-UV. It can be applied to more harsh environments and avoid large-scale deadlights and lights.
Compared with COB, it is characterized by simpler maintenance, lower maintenance cost, larger viewing angle, and 180-degree horizontal viewing angle and vertical viewing angle.
The production steps of the GOB series new products are roughly divided into 3 steps:
1. Choose the best quality materials, lamp beads, industry ultra-high brush IC solutions, high quality LED chips
2. After the product is assembled, aging for 72 hours before GOB filling, the lamp is tested
3. After the GOB is filled, it will be aged for another 24 hours to confirm the product quality again.