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What is the difference between GOB and COB - LEKLED LED Module & LED Screen

GOB-GLUE ON BOARD refers to the filling of the surface of the lamp surface. The production process is, first, we produce the LED module according to the normal procedure, and then fill the lamp surface of the LED module with glue. When the glue is dry, a strong protective layer is formed on the lamp surface of the module. Therefore, the LED shelf screen produced by the GOB LED module will have shockproof, waterproof and dust proof functions.


This means that all conventional modules can be used for gob surface filling. However, the manufacturers who currently master this glue filling technology are not particularly large.



COB (chip-on-board) means that the chip is directly packaged on the entire substrate, that is, N chips are integrated and integrated on the inner substrate for packaging. The COB product directly encapsulates the LED chip in the concave lamp position of the PCB board, and then is cured by epoxy resin, and the surface of the lamp point is convex into a spherical surface, which is smooth and hard, and is resistant to collision and wear.


Simply put, COB can be understood as a packaging process. With the gradual improvement of COB product technology and the further evolution of market demand, the large-scale application of COB packaging technology will reflect its technical advantages and value in the interval of 0.5mm~1.0mm, which is borrowed from the industry. "The COB package is tailored to 1.0mm and below."



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